The market for top 10 advanced materials & technologies in electronics includes products such as G. fast chipset, quantum dots, flexible battery, silicon carbide in semiconductor devices, graphene, 3D IC & 2.5D IC packaging, organic electronics, carbon nanotubes, smart glasses, and biochips. Its superior performance drives the demand for these products as compared to the existing products and its wide range of end-use applications.
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G. fast Chipset is estimated to be the fastest-growing technology in the electronics domain. It is projected to grow at a CAGR of 135.4% from 2016 to 2021, to reach USD 2.97 billion by 2021. Factors such as the growth of 4K TV, rising demand for ultrafast broadband services, supportive government policies to meet national broadband plans, lower cost of deployment, and increased competition among the broadband service providers in developed countries are expected fuel this technology. Some of the key G.fast chipset providers are Broadcom Corporation (U.S.), Qualcomm, Inc. (U.S.), Sckipio Technologies SI Ltd. (Israel), and Metanoia Communications, Inc. (Taiwan).
Quantum dots which is often called artificial atom are semiconductors that are on the nanometer scale is the fastest-growing material in electronics domain. In 2015, the total market size of quantum dots was USD 404.5 million in 2016; and is expected to reach USD 7.68 billion by 2021, at a CAGR of 63.4% from 2016 to 2021. The major driver for the quantum dots are increased consumer preferences for mobility and growing demand for quantum dots with superior performance and resolution quality. However, slow adoption of this technology due to lack of awareness, and availability of low cost technologies act as restraints for the growth of this market.
Flexible battery is the third-highest growing product among the advanced materials & technologies in electronics market. The flexible battery segment is estimated to grow at a CAGR of 44.9% CAGR from 2016 to 2021, to reach USD 615.4 million by 2021. Flexible battery has various features, such as flexibility, temperature stability, are safe, and have longer shelf life. These batteries provide the strength to boost the market for miniaturization in wearable and healthcare devices, and they also help increase the scope of application. Factors such as the growing demand for wearable electronics, rising demand for thin and flexible batteries in electronic devices, and increasing miniaturization of electronic products propels the growth of the market.
The top 10 advanced materials & technologies in electronics market is rapidly growing, with the major market players playing a crucial role in the development of the market. The market is led by players such as Broadcom Ltd. (U.S.), STMicroelectronics N.V. (Switzerland), Toshiba Corporation (Japan), Samsung Electronics Co., Ltd., (South Korea), and Taiwan Semiconductor Manufacturing Company Limited (Taiwan).
The growth of the market was influenced by both organic & inorganic strategies such as partnerships, agreements & collaborations, new product launches, product development, investments and expansions during the period, 2011 to 2016. Some of the companies who adopted these strategies are Broadcom Ltd. (U.S.), STMicroelectronics N.V. (Switzerland), Toshiba Corporation (Japan), and Samsung Electronics Co., Ltd., (South Korea). These strategies have helped them strengthen their shares in the emerging markets.
STMicroelectronics N.V. (Switzerland) designs, develops, manufactures, and markets a wide range of semiconductor integrated circuits and discrete devices. The company is focusing on developing its market presence in material & technology market through new product launches, product developments, partnerships, agreements, and collaborations. In 2015, the company launched the EnFilm thin-film batteries. In 2014, the company developed 1200V silicon carbide based MOSFETs (Metal-Oxide-Semiconductor Field Effect Transistor) for the applications in climate control devices and solar inverters. The company collaborated with Circuits Multi Projects (France) and service organizations in ICs and MEMS, to make THELMA MEMS manufacturing processes available to universities, research labs, and design firms for prototyping.
Samsung Electronics Co., Ltd., (South Korea) along with its subsidiaries operates in the following business divisions: consumer electronics (CE), information technology and mobile communications (IM), semiconductor, and display. The company adopted strategies such as expansion, partnership agreement, product development and new product launches to gain a competitive advantage in the market. In 2015, the company started the mass production of 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multilevel-cell (MLC) arrays.
Toshiba Corporation (Japan) adopted strategies such as product development, acquisitions expansions, and new product launch. In 2016, the company expanded its Yokkaichi Operations in Mie, Japan, for the production of BiCS FLASH, its proprietary 3D flash memory. In 2014, the company developed wireless power receiver IC for mobile equipment- TC7763WBG. It also developed TransferJet-Compatible 3D-Integrated Ultra-Small Module and Ultra-Thin FPC Coupler in 2014.
For More Context Download PDF Brochure of this Report at http://www.marketsandmarkets.com/pdfdownload.asp?id=205930560
G. fast Chipset is estimated to be the fastest-growing technology in the electronics domain. It is projected to grow at a CAGR of 135.4% from 2016 to 2021, to reach USD 2.97 billion by 2021. Factors such as the growth of 4K TV, rising demand for ultrafast broadband services, supportive government policies to meet national broadband plans, lower cost of deployment, and increased competition among the broadband service providers in developed countries are expected fuel this technology. Some of the key G.fast chipset providers are Broadcom Corporation (U.S.), Qualcomm, Inc. (U.S.), Sckipio Technologies SI Ltd. (Israel), and Metanoia Communications, Inc. (Taiwan).
Quantum dots which is often called artificial atom are semiconductors that are on the nanometer scale is the fastest-growing material in electronics domain. In 2015, the total market size of quantum dots was USD 404.5 million in 2016; and is expected to reach USD 7.68 billion by 2021, at a CAGR of 63.4% from 2016 to 2021. The major driver for the quantum dots are increased consumer preferences for mobility and growing demand for quantum dots with superior performance and resolution quality. However, slow adoption of this technology due to lack of awareness, and availability of low cost technologies act as restraints for the growth of this market.
Flexible battery is the third-highest growing product among the advanced materials & technologies in electronics market. The flexible battery segment is estimated to grow at a CAGR of 44.9% CAGR from 2016 to 2021, to reach USD 615.4 million by 2021. Flexible battery has various features, such as flexibility, temperature stability, are safe, and have longer shelf life. These batteries provide the strength to boost the market for miniaturization in wearable and healthcare devices, and they also help increase the scope of application. Factors such as the growing demand for wearable electronics, rising demand for thin and flexible batteries in electronic devices, and increasing miniaturization of electronic products propels the growth of the market.
The top 10 advanced materials & technologies in electronics market is rapidly growing, with the major market players playing a crucial role in the development of the market. The market is led by players such as Broadcom Ltd. (U.S.), STMicroelectronics N.V. (Switzerland), Toshiba Corporation (Japan), Samsung Electronics Co., Ltd., (South Korea), and Taiwan Semiconductor Manufacturing Company Limited (Taiwan).
The growth of the market was influenced by both organic & inorganic strategies such as partnerships, agreements & collaborations, new product launches, product development, investments and expansions during the period, 2011 to 2016. Some of the companies who adopted these strategies are Broadcom Ltd. (U.S.), STMicroelectronics N.V. (Switzerland), Toshiba Corporation (Japan), and Samsung Electronics Co., Ltd., (South Korea). These strategies have helped them strengthen their shares in the emerging markets.
STMicroelectronics N.V. (Switzerland) designs, develops, manufactures, and markets a wide range of semiconductor integrated circuits and discrete devices. The company is focusing on developing its market presence in material & technology market through new product launches, product developments, partnerships, agreements, and collaborations. In 2015, the company launched the EnFilm thin-film batteries. In 2014, the company developed 1200V silicon carbide based MOSFETs (Metal-Oxide-Semiconductor Field Effect Transistor) for the applications in climate control devices and solar inverters. The company collaborated with Circuits Multi Projects (France) and service organizations in ICs and MEMS, to make THELMA MEMS manufacturing processes available to universities, research labs, and design firms for prototyping.
Samsung Electronics Co., Ltd., (South Korea) along with its subsidiaries operates in the following business divisions: consumer electronics (CE), information technology and mobile communications (IM), semiconductor, and display. The company adopted strategies such as expansion, partnership agreement, product development and new product launches to gain a competitive advantage in the market. In 2015, the company started the mass production of 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multilevel-cell (MLC) arrays.
Toshiba Corporation (Japan) adopted strategies such as product development, acquisitions expansions, and new product launch. In 2016, the company expanded its Yokkaichi Operations in Mie, Japan, for the production of BiCS FLASH, its proprietary 3D flash memory. In 2014, the company developed wireless power receiver IC for mobile equipment- TC7763WBG. It also developed TransferJet-Compatible 3D-Integrated Ultra-Small Module and Ultra-Thin FPC Coupler in 2014.
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