Thursday, March 16, 2017

Top 10 High Growth Composite Materials Market Industry

Investment & expansions were the key development strategies adopted by the leading market players to achieve growth in the top 10 high growth composite materials market

Top 10 composite materials are used in various applications, namely, aerospace & defense, transportation, marine, and sports goods. The growth of the composites market can be attributed to the high demand from end-use applications.

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The key players in the top 10 high growth composite materials market are Hexcel Corporation (U.S.), Hexion Inc. (U.S.), Strongwell Corporation (U.S.), Toray Industries Inc. (Japan), Teijin Limited (Japan), DAIB Group (Sweden), Celanese Corporation (U.S.), and IDI Composites (U.S.). These players have adopted various strategies to expand their global presence and increase their market shares. Capacity expansions, product launches, and agreements, joint ventures & partnerships are the major strategies adopted by the market players to achieve growth in the market. The key companies offering composites are involved in investment & expansions to strengthen their position in the top 10 high growth composite materials market. Companies such as Huntsman Corporation (U.S.), Hexion Inc. (U.S.), Toray Industries (Japan) adopted this strategy. Companies also adopted the strategy of partnership, joint venture & agreements, in order to expand their composite product reach globally and take advantage of each-others competencies to compete in the market.

Toray Industries Inc. focuses mainly on acquisitions, agreements, expansions, and new product developments to tap the growing demand and expand its market globally. In September 2015, the company acquired 55% of Delta Tech S.p.A. (Italy) which produces and supplies high-quality prepreg and carbon fiber for automobile applications. This acquisition helped the company to increase the sale of carbon fibers for luxury cars.

Hexcel Corporation (U.S.) is a global manufacturer of composites, core materials, and prepregs. The company recently launched new composite material at JEC world 2016. The company showcased nacelle inner fixed structure (IFS) for Airbus A320neo. This material is manufactured by Aircelle using Hexcel’s HexPly 8552 slit tape prepreg, reinforced with HexTow AS4 carbon fiber. The company manufacturers products to be specifically used for components in commercial and military aircraft, space launch vehicles and satellites, wind turbine blades, and industrial/recreational applications. Hexcel Corporation established a new manufacturing facility in Casablanca, Morocco in January 2016. This facility was established with a view to cater to the increasing demand for core structure, which involves the production of honeycomb materials. This approach by the company was aimed to target the aerospace industry providing secondary structures of aircraft, nacelles, and helicopter blades. In 2012 the company signed a distribution agreement with Sikorsky Aircraft (U.S.) to supply HexWeb honeycomb materials.

Delta Group produces and supplies high-quality prepreg and process carbon fiber for automobile applications.

Aerospace & defense and transportation application segments are expected to play a key role in the growth of top 10 high growth composite material market

Asia-Pacific is projected to be the fastest-growing region for the top 10 high growth composite materials market, during the forecast period. The growing demand for composites, emission control policies, and introduction of environmental-friendly products, have led to innovations in the region. This is consequently expected to fuel the growth of the market in the region. North America is the second-largest consumer of composites, after its recovery from the economic recession of 2008–2009, as the rise in expenditure on non-residential constructions has led to increased demand for composites in the region.

The top 10 high growth composite materials market is dominated by the aerospace & defense, transportation, wind energy, and electrical & electronics applications. The demand for lightweight composite material is driven by increasing demand for fuel efficiency and lightweight components. The primary benefits that composite materials offer are reduced weight and greater assembly simplification, as compared to traditional materials, such as steel, aluminum, and titanium, in the manufacturing of aircraft.

The injection molding segment is projected to witness highest growth during the forecast period. The high growth of the segment can be attributed to the use of the process to manufacture various transportation and electrical & electronics parts, which are major applications of composites. The injection molding process offers products that provide creep resistance, good strength to weight ratio, and thermal insulation.

Thermosetting resins are widely used in various composites, as they have excellent resistance to solvents and corrosives and are resistant to high temperatures. Glass fibers are the most common reinforcement used in automotive, electronics & electricals, and boats & marine applications to replace heavy metal parts.

Asia-Pacific dominated the top 10 high growth composite materials market, due to the presence of growing economies, such as China and India. China led the market in Asia-Pacific, owing to the growth in the transportation and construction industries in the country.

The key players in the top 10 high growth composite materials market are Hexcel Corporation (U.S.), Hexion Inc. (U.S.), Owens Corning (U.S.), Strongwell Corporation (U.S.), Toray Industries Inc. (Japan), Teijin Limited (Japan), DAIB Group (Sweden), and Celanese Corporation (U.S.).

Top 10 Advanced Materials & Technologies Market Industry - Revenue Pockets & Market Leader

The market for top 10 advanced materials & technologies in electronics includes products such as G. fast chipset, quantum dots, flexible battery, silicon carbide in semiconductor devices, graphene, 3D IC & 2.5D IC packaging, organic electronics, carbon nanotubes, smart glasses, and biochips. Its superior performance drives the demand for these products as compared to the existing products and its wide range of end-use applications. 

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G. fast Chipset is estimated to be the fastest-growing technology in the electronics domain. It is projected to grow at a CAGR of 135.4% from 2016 to 2021, to reach USD 2.97 billion by 2021. Factors such as the growth of 4K TV, rising demand for ultrafast broadband services, supportive government policies to meet national broadband plans, lower cost of deployment, and increased competition among the broadband service providers in developed countries are expected fuel this technology. Some of the key G.fast chipset providers are Broadcom Corporation (U.S.), Qualcomm, Inc. (U.S.), Sckipio Technologies SI Ltd. (Israel), and Metanoia Communications, Inc. (Taiwan).

Quantum dots which is often called artificial atom are semiconductors that are on the nanometer scale is the fastest-growing material in electronics domain. In 2015, the total market size of quantum dots was USD 404.5 million in 2016; and is expected to reach USD 7.68 billion by 2021, at a CAGR of 63.4% from 2016 to 2021. The major driver for the quantum dots are increased consumer preferences for mobility and growing demand for quantum dots with superior performance and resolution quality. However, slow adoption of this technology due to lack of awareness, and availability of low cost technologies act as restraints for the growth of this market.

Flexible battery is the third-highest growing product among the advanced materials & technologies in electronics market. The flexible battery segment is estimated to grow at a CAGR of 44.9% CAGR from 2016 to 2021, to reach USD 615.4 million by 2021. Flexible battery has various features, such as flexibility, temperature stability, are safe, and have longer shelf life. These batteries provide the strength to boost the market for miniaturization in wearable and healthcare devices, and they also help increase the scope of application. Factors such as the growing demand for wearable electronics, rising demand for thin and flexible batteries in electronic devices, and increasing miniaturization of electronic products propels the growth of the market.

The top 10 advanced materials & technologies in electronics market is rapidly growing, with the major market players playing a crucial role in the development of the market. The market is led by players such as Broadcom Ltd. (U.S.), STMicroelectronics N.V. (Switzerland), Toshiba Corporation (Japan), Samsung Electronics Co., Ltd., (South Korea), and Taiwan Semiconductor Manufacturing Company Limited (Taiwan).

The growth of the market was influenced by both organic & inorganic strategies such as partnerships, agreements & collaborations, new product launches, product development, investments and expansions during the period, 2011 to 2016.  Some of the companies who adopted these strategies are Broadcom Ltd. (U.S.), STMicroelectronics N.V. (Switzerland), Toshiba Corporation (Japan), and Samsung Electronics Co., Ltd., (South Korea). These strategies have helped them strengthen their shares in the emerging markets.

STMicroelectronics N.V. (Switzerland) designs, develops, manufactures, and markets a wide range of semiconductor integrated circuits and discrete devices. The company is focusing on developing its market presence in material & technology market through new product launches, product developments, partnerships, agreements, and collaborations. In 2015, the company launched the EnFilm thin-film batteries. In 2014, the company developed 1200V silicon carbide based MOSFETs (Metal-Oxide-Semiconductor Field Effect Transistor) for the applications in climate control devices and solar inverters. The company collaborated with Circuits Multi Projects (France) and service organizations in ICs and MEMS, to make THELMA MEMS manufacturing processes available to universities, research labs, and design firms for prototyping.

Samsung Electronics Co., Ltd., (South Korea) along with its subsidiaries operates in the following business divisions: consumer electronics (CE), information technology and mobile communications (IM), semiconductor, and display. The company adopted strategies such as expansion, partnership agreement, product development and new product launches to gain a competitive advantage in the market. In 2015, the company started the mass production of 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multilevel-cell (MLC) arrays.

Toshiba Corporation (Japan) adopted strategies such as product development, acquisitions expansions, and new product launch. In 2016, the company expanded its Yokkaichi Operations in Mie, Japan, for the production of BiCS FLASH, its proprietary 3D flash memory. In 2014, the company developed wireless power receiver IC for mobile equipment- TC7763WBG. It also developed TransferJet-Compatible 3D-Integrated Ultra-Small Module and Ultra-Thin FPC Coupler in 2014.